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Snapshots

  1. scale bar

    Snapshot Title: scale bar
    Taken by: jay longson

    Image: Imagain the imager
    Image Owner: jay longson



    Description:

    ~0.1mm or 100┬Ám.



  2. pixels!

    Snapshot Title: pixels!
    Taken by: jay longson

    Image: Imagain the imager
    Image Owner: jay longson



    Description:

    Thes are little filters over the pixel sensors, probably little photoelectric devices like mini photovoltaics.



  3. Test/calibration area

    Snapshot Title: Test/calibration area
    Taken by: jay longson

    Image: Imagain the imager
    Image Owner: jay longson



    Description:

    The colors are labeled Magenta, Cyan, and Yellow, not RGB ;)



  4. Via

    Snapshot Title: Via
    Taken by: jay longson

    Image: Imagain the imager
    Image Owner: jay longson



    Description:

    I'm pretty sure these little square patches seen all over the chip are actually indentations from the via which serve to electrically connect one layer to another.



  5. Bond pad

    Snapshot Title: Bond pad
    Taken by: jay longson

    Image: Imagain the imager
    Image Owner: jay longson



    Description:

    this is a wire bonded bond pad, this is what is used to make the electrical connections from the wafer to the packaging on the chip. You can see the wire sticking out of the bond pad, becoming out of ...



  6. Test probes

    Snapshot Title: Test probes
    Taken by: jay longson

    Image: Imagain the imager
    Image Owner: jay longson



    Description:

    the scrapes on these bond pads show that they were used for testing of the chip during the manufacturing process. neat!