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Snapshots

  1. stitching artifact

    Snapshot Title: stitching artifact
    Taken by: jay longson

    Image: imaging the imager
    Image Owner: jay longson



    Description:

    this stitching artifact is attributed to a combination of events, the chip plane started drifting out of fousus and the xy stage controller stopped panning sonner than I had wanted, I had to capture t...



  2. Test/Calibration area

    Snapshot Title: Test/Calibration area
    Taken by: Rich Gibson

    Image: imaging the imager
    Image Owner: jay longson



    Description:

    The colors are labeled Magenta, Cyan, and Yellow, not the complements.



  3. via

    Snapshot Title: via
    Taken by: jay longson

    Image: imaging the imager
    Image Owner: jay longson



    Description:

    I'm pretty sure these little square patches seen all over the chip are actually indentations from the via which serve to electrically connect one layer to another.



  4. RGB

    Snapshot Title: RGB
    Taken by: jay longson

    Image: imaging the imager
    Image Owner: jay longson



    Description:

    pixels!!



  5. bond pad

    Snapshot Title: bond pad
    Taken by: jay longson

    Image: imaging the imager
    Image Owner: jay longson



    Description:

    this is a wire bonded bond pad, this is what is used to make the electrical connections from the wafer to the packaging on the chip. You can see the wire sticking out of the bond pad, becoming out of ...



  6. test probes

    Snapshot Title: test probes
    Taken by: jay longson

    Image: imaging the imager
    Image Owner: jay longson



    Description:

    the scrapes on these bond pads show that they were used for testing of the chip during the manufacturing process. neat!



  7. all the colors of the rainbow

    Snapshot Title: all the colors of the rainbow
    Taken by: jay longson

    Image: imaging the imager
    Image Owner: jay longson



    Description:

    ..